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Copper is an excellent undercoat for subsequent deposits, since it is an excellent metal to cover various substrates. Copper has a high plating efficiency and the copper plating process offers very uniform coverage. Copper's high electrical conductivity is exceeded only by silver, making it an excellent and inexpensive coating for products that require electrical conductivity. This allows the use of a very inexpensive substrate such as steel and still achieves the desired electrical performance of Copper.

The Copper process used by Ctech is a Cyanide Copper bath. A cyanide copper solution can be used in either rack or barrel plating. The most common use of Copper plating is a “strike process”. A cyanide-copper strike bath is typically used to deposit a thin, adherent layer that can completely cover an active metal surface such as zinc or steel prior to further plating operations. The maximum practical deposit thickness is typically in the range of 0.05 to 0.10 mil. The copper strike serves only as a protective layer for further plating, typically with nickel or Tin. It also improves adhesion and in some cases acts as "insurance" in the pre-plate cycle.

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